- Fabricante：
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- Material：
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- Operating Temperature：
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- Attachment Method：
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- Plating - Thickness：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies EMI | ENSL,SILSP,SCF,PS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | ENSL,SILSP,SCF,PS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CONTACT BECU 3.3X1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | 3.2H SHLD FINGER L... |
1 |
42,521
In-stock
|
Obtener cotización |
