- Fabricante：
-
- Molex (3)
- JAE Electronics (1)
- WEC (1)
- Product Status：
-
- Features：
-
- Height Above Board：
-
- Connector Type：
-
- Number of Positions：
-
- Contact Finish：
-
- Contact Finish Thickness：
-
- Insertion, Removal Method：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Molex | MSD/NSIM COMBO 2.0... |
1 |
40,019
In-stock
|
Obtener cotización | ||
|
|
Hirose Electric Co Ltd | CONN SOCKET MICR... |
1 |
11,563
In-stock
|
Obtener cotización | ||
|
|
Molex | MSD/NSIM 3IN2 1.45H ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Molex | 3IN2 ANTI CRUSH CN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
JAE Electronics | COMBO MICRO SD/NA... |
1 |
1,150
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | CONN COMBO CARD P... |
1 |
495
In-stock
|
Obtener cotización | ||
|
|
WEC | CONN COMBO CARD P... |
1 |
50,000
In-stock
|
Obtener cotización |
