- Fabricante：
-
- Molex (1)
- CUI Devices (6)
- Wakefield-Vette (1)
- Product Status：
-
27 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | HEATSINK CLIP |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | HEATSINK CLIP |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | HEATSINK CLIP |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | HEATSINK CLIP |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | CLIP HEAT SINK 84P... |
1 |
350
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK CLIP FO... |
1 |
1,765
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK CLIP FO... |
1 |
2,798
In-stock
|
Obtener cotización |
