- Fabricante:
-
- MG Chemicals (1)
- Techspray (2)
- Wakefield-Vette (4)
- Size / Dimension:
-
- Storage/Refrigeration Temperature:
-
- Usable Temperature Range:
-
- Thermal Conductivity:
-
11 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Techspray | SILICONE FREE HE... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERMAL PASTE |
1 |
50,000
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERMAL PASTE |
1 |
50,000
In-stock
|
Obtener cotización | |||
Wakefield-Vette | THERMAL COMPOUND... |
1 |
429
In-stock
|
Obtener cotización | |||
Wakefield-Vette | NONSILICONE GREA... |
1 |
169
In-stock
|
Obtener cotización | |||
Wakefield-Vette | NONSILICONE GREA... |
1 |
25
In-stock
|
Obtener cotización | |||
Techspray | SILICONE FREE HE... |
1 |
31
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERMAL PASTE |
1 |
61
In-stock
|
Obtener cotización | |||
Wakefield-Vette | NONSILICONE GREA... |
1 |
50,000
In-stock
|
Obtener cotización | |||
NTE Electronics, Inc | 1 OZ HEAT SINK COM... |
1 |
58
In-stock
|
Obtener cotización | |||
MG Chemicals | EPOXY MOLD RELEA... |
1 |
7
In-stock
|
Obtener cotización |