- Fabricante：
-
- Chip Quik Inc. (3)
- Size / Dimension：
-
- Storage/Refrigeration Temperature：
-
- Thermal Conductivity：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
19
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TGREASE 880S 0.5 KG |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TGREASE 880S 1.0 KG |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
10
In-stock
|
Obtener cotización |
