- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | 4.00" WIDE X 12" FLAT... |
1 |
13
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK C2026 REV... |
1 |
80
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 4.00" WIDE X 36" FLAT... |
1 |
32
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 4.000" X 12" H STYLE H... |
1 |
52
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 4.00" WIDE X 12" FLAT... |
1 |
47
In-stock
|
Obtener cotización |
