- Product Status:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
6 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
CTS Thermal Management Products | HEATSINK CLIP ON... |
1 |
782
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK LOW PRO... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CLIP ON... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CLIP ON... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CLIP ON... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CLIP ON... |
1 |
50,000
In-stock
|
Obtener cotización |