- Fabricante：
-
- Comair Rotron (2)
- CUI Devices (2)
- Wakefield-Vette (2)
- Product Status：
-
- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
- Material Finish：
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12 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
7,025
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PA... |
1 |
24,170
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK PWR .75"H... |
1 |
1,760
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
1 |
9,368
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
749
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |
