- Fabricante：
-
- CUI Devices (1)
- Sarnikon (3)
- Product Status：
-
- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Material Finish：
-
9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
195
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SIN... |
1 |
426
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | HEATSINK CER 12X12... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | HEATSINK CER 12X12... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización |
