- Fabricante：
-
- Wakefield-Vette (3)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc | HEAT SINK |
1 |
37
In-stock
|
Obtener cotización | ||
|
|
NTE Electronics, Inc | HEAT SINK |
1 |
56
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Obtener cotización |
