- Fabricante：
-
- CUI Devices (1)
- Ohmite (4)
- Material：
-
- Attachment Method：
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- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK W/CLIP F... |
1 |
773
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
4,992
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
15,871
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK W/CLIP F... |
1 |
1,143
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
8,014
In-stock
|
Obtener cotización |
