- Material：
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- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK POWER T... |
1 |
330
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK POWER N... |
1 |
203
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK POWER N... |
1 |
1,107
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR TO3 |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR TO3 |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK PWR NO ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR TO3 |
1 |
50,000
In-stock
|
Obtener cotización |
