Product Status:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Imagen Parte Fabricante Descripción MOQ Valores Acción
V-1100-SMD/A Assmann WSW Components
HEATSINK TO-263 12.7...
1
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V-1100-SMD/A-L Assmann WSW Components
HEATSINK TO-263 12.7...
1
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ATS-PCB1074 Advanced Thermal Solutions Inc.
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ATS-PCB1073 Advanced Thermal Solutions Inc.
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832700T00000 Comair Rotron
HEATSINK STAMP 26...
1
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In-stock
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