- Fabricante：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 45MM X 45... |
1 |
59
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 50MM X 45... |
1 |
76
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
803
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 50MM X 45... |
1 |
899
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
100
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 45MM X 45... |
1 |
32
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 45X45X19.5M... |
1 |
50,000
In-stock
|
Obtener cotización |
