- Fabricante：
-
- CUI Devices (2)
- Sarnikon (7)
- Material：
-
- Length：
-
- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
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12 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
666
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
1,326
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | THM,ZA1831 ISS 3 TV-... |
1 |
348
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
