- Fabricante：
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- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-126 13.2... |
1 |
2,668
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-126 BL... |
1 |
141
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.4W... |
1 |
50,000
In-stock
|
Obtener cotización |
