- Fabricante：
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- CUI Devices (1)
- Product Status：
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- Type：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 58MM X 30... |
1 |
67
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Obtener cotización |
