- Fabricante：
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- Product Status：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc | HEATSINK FOR PLA... |
1 |
1,312
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
994
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 CO... |
1 |
9,688
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 CO... |
1 |
1,284
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
50,000
In-stock
|
Obtener cotización |
