- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
2,203
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
29
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
50,000
In-stock
|
Obtener cotización |
