- Fabricante：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,768
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
78
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
85
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
784
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 25MM X 25... |
1 |
1,444
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
1 |
841
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,009
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 25MM X 25... |
1 |
925
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 25X25X12.5M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
