- Fabricante：
-
- CUI Devices (1)
- Wakefield-Vette (1)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
1 |
4,437
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
1 |
2,935
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,988
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | MAX CLIP HEATSIN... |
1 |
599
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
1 |
2,308
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
2,616
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | MAX CLIP HEATSIN... |
1 |
546
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |
