- Fabricante：
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- CUI Devices (2)
- Type：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
16,461
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
749
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
1 |
50,000
In-stock
|
Obtener cotización |
