- Fabricante：
-
- Comair Rotron (2)
- CUI Devices (1)
- Wakefield-Vette (1)
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK BLK ALU... |
1 |
1,263
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220 SM... |
1 |
4,351
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
3,231
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 (DU... |
1 |
781
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 36... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK DUAL HO... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
1 |
50,000
In-stock
|
Obtener cotización |
