- Fabricante：
-
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
311
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | PH3N NANO 50.8X12.07X... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | PH3 50.8X12.07X0.21MM |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Obtener cotización |
