- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
80
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
210
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
22
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
17
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Obtener cotización |
