- Fabricante：
-
- CUI Devices (3)
- iBASE Technology (1)
- Material：
-
- Width：
-
- Attachment Method：
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- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | FANSINK ASSEMBLY... |
1 |
93
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | FANSINK ASSEMBLY... |
1 |
79
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | FANSINK ASSEMBLY... |
1 |
74
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | FANSINK ASSEMBLY... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
iBASE Technology | HEATSINK;HSIBR117... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
