- Fabricante：
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- CUI Devices (1)
- Type：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-220 15X... |
1 |
42,873
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK ANOD AL... |
1 |
1,950
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK ANOD AL... |
1 |
498
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
168
In-stock
|
Obtener cotización |
