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- CUI Devices (1)
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- Package Cooled：
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- Thermal Resistance @ Natural：
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2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ANOD AL... |
1 |
41,385
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
Obtener cotización |
