- Material：
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- Type：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEAT SINK BGA/PGA... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
1 |
2,920
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
1 |
50,000
In-stock
|
Obtener cotización |
