- Fabricante：
-
- CUI Devices (2)
- Wakefield-Vette (2)
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK TO-220 DU... |
1 |
1,898
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
1 |
12,033
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK TO-220 29.9... |
1 |
1,426
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
2,705
In-stock
|
Obtener cotización | ||
|
|
NTE Electronics, Inc | HEAT SINK-PLAST. ... |
1 |
197
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 4.5W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 BL... |
1 |
1,906
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
513
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
362
In-stock
|
Obtener cotización |
