- Fabricante：
-
- Ohmite (1)
- Material：
-
- Shape：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK BLACK A... |
1 |
350
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
76
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
32
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
89
In-stock
|
Obtener cotización |
