- Fabricante：
-
- CUI Devices (2)
- Wakefield-Vette (2)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Obtener cotización |
