- Fabricante：
-
- Comair Rotron (2)
- Wakefield-Vette (3)
- Material：
-
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 17... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK VERT .85"... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
50,000
In-stock
|
Obtener cotización |
