- Fabricante：
-
- Comair Rotron (6)
- Wakefield-Vette (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
347
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
937
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220/202 ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
50,000
In-stock
|
Obtener cotización |
