- Fabricante：
-
- Comair Rotron (1)
- Ohmite (2)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-1... |
1 |
50,000
In-stock
|
Obtener cotización |
