- Fabricante：
-
- Comair Rotron (1)
- CUI Devices (2)
- Wakefield-Vette (3)
- Product Status：
-
- Material：
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- Width：
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- Length：
-
- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
1 |
4,814
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
300
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
ABB Power Electronics Inc. | HEATSINK 2.39L X.45"... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
ABB Power Electronics Inc. | HEATSINK 2.27L X.45"... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK SMT PKG |
1 |
50,000
In-stock
|
Obtener cotización |
