- Fabricante：
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- Wakefield-Vette (1)
- Package Cooled：
-
- Fin Height：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | CPU HEAT SINK NO ... |
1 |
8
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | COPPER HEATSINK ... |
1 |
99
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
50,000
In-stock
|
Obtener cotización |
