- Fabricante：
-
- Attachment Method：
-
- Package Cooled：
-
- Material Finish：
-
6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | DUALFLOW HEATSIN... |
1 |
39
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | QUADFLOW HEATSIN... |
1 |
18
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | DUALFLOW HEATSIN... |
1 |
15
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | QUADFLOW HEATSIN... |
1 |
20
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | INTEL XEON CPU CO... |
1 |
12
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | INTEL XEON CPU CO... |
1 |
50,000
In-stock
|
Obtener cotización |
