- Fabricante：
-
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Obtener cotización |
