- Fabricante：
-
- Brainboxes (1)
- DFRobot (1)
- Product Status：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
10 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Seeed Technology Co., Ltd | HEAT SINK KIT FOR... |
1 |
1,341
In-stock
|
Obtener cotización | ||
|
|
OSEPP Electronics LTD | RASPBERRY PI LOW... |
1 |
43
In-stock
|
Obtener cotización | ||
|
|
OSEPP Electronics LTD | RASPBERRY PI TAL... |
1 |
211
In-stock
|
Obtener cotización | ||
|
|
DFRobot | RASPBERRY PI COP... |
1 |
305
In-stock
|
Obtener cotización | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM ALLOY C... |
1 |
11
In-stock
|
Obtener cotización | ||
|
|
OSEPP Electronics LTD | RASPBERRY PI COP... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Brainboxes | RASPBERRY PI COM... |
1 |
25
In-stock
|
Obtener cotización | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM ALLOY C... |
1 |
16
In-stock
|
Obtener cotización | ||
|
|
Seeed Technology Co., Ltd | RPI HEAT SINK KIT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Seeed Technology Co., Ltd | RASPERRY PI COPP... |
1 |
50,000
In-stock
|
Obtener cotización |
