- Fabricante：
-
- CUI Devices (27)
- Wakefield-Vette (12)
- Material：
-
- Width：
-
- Length：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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39 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,636
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,105
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 1.75WX12" EXTRUS 16249... |
1 |
61
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 1.1WX12" EXTRUSI 1624... |
1 |
90
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 1.40" WIDE X 12" BGA H... |
1 |
91
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 2.1WX12" EXTRUS 12554 ... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,708
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 2.1WX36" EXTRUS 12554 ... |
1 |
6
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 1.66" WIDE X 12" BGA H... |
1 |
45
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,166
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
803
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
101
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,540
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
Obtener cotización |
