- Fabricante：
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- CUI Devices (1)
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
532
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
50,000
In-stock
|
Obtener cotización |
