- Fabricante:
-
- Wakefield-Vette (1)
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
8 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
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Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA 35X35... |
1 |
1,232
In-stock
|
Obtener cotización | ||
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Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
2,491
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
85
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/O ... |
1 |
1,144
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 25MM X 25... |
1 |
1,444
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 25MM X 25... |
1 |
925
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK 25X25X12.5M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
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Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Obtener cotización |