- Fabricante：
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- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
19,441
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
5,362
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PA... |
1 |
24,170
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
1 |
9,368
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-P... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
1 |
50,000
In-stock
|
Obtener cotización |
