- Fabricante:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
1,498
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK 18-DIP BL... |
1 |
50,000
In-stock
|
Obtener cotización |