- Fabricante：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
7,205
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
199
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
68
In-stock
|
Obtener cotización |
