- Fabricante：
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- Sarnikon (1)
- Wakefield-Vette (1)
- Material：
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- Type：
-
- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,574
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | TO-220 HEATSINK 25M... |
1 |
500
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,538
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,857
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | FANSINK 5VDC 47.5X4... |
1 |
50,000
In-stock
|
Obtener cotización |
