Material:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Imagen Parte Fabricante Descripción MOQ Valores Acción
573400D00000G Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT...
1
RFQ
3,264
In-stock
Obtener cotización
ATS-PCB1074 Advanced Thermal Solutions Inc.
HEATSINK TO-263 CO...
1
RFQ
8,604
In-stock
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573400D00010G Aavid, Thermal Division of Boyd Corporation
HEATSINK D-PAK3 T...
1
RFQ
6,633
In-stock
Obtener cotización
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