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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,264
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
1 |
8,604
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 T... |
1 |
6,633
In-stock
|
Obtener cotización |