- Fabricante：
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- CUI Devices (2)
- Material：
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- Type：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,771
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,544
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,143
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | QSFP SINGLE SAN E... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | QSFP DOUBLE SAN H... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP SAN E... |
1 |
50,000
In-stock
|
Obtener cotización |
