- Fabricante：
-
- CUI Devices (9)
- WEC (1)
- Product Status：
-
- Material：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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- Material Finish：
-
16 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1 |
3,033
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
2,015
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HTSK-AL-PF750 REV A... |
1 |
703
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-218/TO... |
1 |
379
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-218/TO... |
1 |
9,162
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK BLK ANO... |
1 |
432
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
422
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
502
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
239
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
515
In-stock
|
Obtener cotización | ||
|
|
WEC | HEATSINK TO-220 2.9W... |
1 |
3,707
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
52
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
1 |
50,000
In-stock
|
Obtener cotización |
